Electro-optical device and electronic equipment

ABSTRACT

An electro-optical devices includes: a first substrate; a second substrate having one surface opposite to the first substrate; a support member configured to hold the first and second substrates with the second substrate located outside the first substrate, and to include a frame portion surrounding the first and second substrates; a first conductive film formed on the other surface of the second substrate; and a conductor layer placed between the frame portion and the first and second substrates, and electrically connected to the first conductive film. The first conductive film is held at a constant potential via the conductor layer.

CROSS REFERENCES TO RELATED APPLICATIONS

The present application is a continuation application of U.S. patentapplication Ser. No. 15/624,016, filed on Jun. 15, 2017, which is acontinuation application of U.S. patent application Ser. No. 15/182,137,filed on Jun. 14, 2016, issued as U.S. Pat. No. 9,709,837 on Jul. 18,2017, which application is a continuation application of U.S. patentapplication Ser. No. 14/719,579, filed on May 22, 2015, issued as U.S.Pat. No. 9,377,643, on Jun. 28, 2016, which application is acontinuation of U.S. patent application Ser. No. 14/268,751, filed onMay 2, 2014, issued as U.S. Pat. No. 9,069,200, on Jun. 30, 2015, whichapplication is a continuation of U.S. patent application Ser. No.13/025,680, filed on Feb. 11, 2011, issued as U.S. Pat. No. 8,754,997,on Jun. 17, 2014, which application contains subject matter related tothat disclosed in Japanese Priority Patent Application JP 2008-197471filed in the Japan Patent Office on Jul. 31, 2008, the entire contentsof which are hereby incorporated by reference.

BACKGROUND

The present application relates to an electro-optical device includingan insulating opposite substrate, a surface of which is opposite to adevice substrate and formed with no wiring or electrode, and electronicequipment including the electro-optical device.

Electro-optical devices, in which no wiring or electrode is formed on anopposite substrate arranged opposite to a device substrate formed withsignal lines, pixel electrodes, and pixel switching elements, include aliquid crystal device based on the IPS (In Plane Switching) system orthe FFS (Fringe Field Switching) system. In the liquid crystal device,the opposite substrate is arranged outside the device substrate, i.e.,on the output side of display light. Therefore, the opposite substrateis easily charged, and the charging disturbs the orientation of liquidcrystal. In view of this, a method has been proposed which forms a frontsurface-side conductive film on the outer surface of the oppositesubstrate and brings the front surface-side conductive film into contactwith a metal outer frame, to thereby have the opposite substrate held atthe ground potential and prevented from being charged (see JapaneseUnexamined Patent Application Publication No. 2005-43901).

SUMMARY

The configuration by which the front surface-side conductive film formedon the opposite substrate is simply brought into contact with the outerframe, however, has an issue of failure to reliably hold the frontsurface-side conductive film at the ground potential.

Further, in a transmissive or semi-transmissive reflective liquidcrystal device, insulating members, such as a light guide plate and avariety of optical sheets of a backlight device, are arranged in asuperimposed manner on the side of the other surface of the devicesubstrate. Such a liquid crystal device has an issue in that, if acommon potential of a predetermined frequency is applied to a commonelectrode formed on the device substrate, charging of the light guideplate or the variety of optical sheets occurs and causes high-frequencynoise. That is, if the charged state of the light guide plate or theoptical sheets changes in conjunction with the change in potential ofthe common electrode, vibration occurs in the light guide plate or theoptical sheets, and vibration in an audible range of 10 to 25 kHz causeshigh-frequency noise sound.

In view of the above-described issues, it is desirable in the presentapplication to provide an electro-optical device and electronicequipment capable of reliably preventing the charging of the oppositesubstrate.

It is also desirable in the present application to provide anelectro-optical device and electronic equipment capable of reliablypreventing the charging of the insulating members arranged on the sideof the other surface of the device substrate, as well as the charging ofthe opposite substrate.

According to an embodiment, there is provided an electro-optical devicewhich includes: a first substrate; a second substrate having one surfaceopposite to the first substrate; a support member configured to hold thefirst and second substrates with the second substrate located outsidethe first substrate, and to include a frame portion surrounding thefirst and second substrates; a first conductive film formed on the othersurface of the second substrate; and a conductor layer placed betweenthe frame portion and the first and second substrates, and electricallyconnected to the first conductive film. The first conductive film isheld at a constant potential via the conductor layer. In the embodiment,the conductor layer may use a conductive paste including a matrixmaterial and a plurality of conductive particles contained in the matrixmaterial. Further, in the embodiment, the first substrate may be adevice substrate having an inner surface formed with pixel electrodes,switching elements connected to the pixel electrodes, and wiringconnected to the switching elements, and the second substrate may be anopposite substrate opposite to the device substrate. Of course, anopposite substrate may be used as the first substrate, and a devicesubstrate may be used as the second substrate.

In the embodiment, the “electro-optical device” refers to a device whichmodulates light on the basis of an electrical signal, such as a liquidcrystal device and an organic electroluminescence device, and a devicewhich converts an optical signal into an electrical signal, such as animage sensor.

In the embodiment, a gap between the opposite substrate and the frameportion surrounding the respective peripheries of the device substrateand the opposite substrate in the support member is filled with theconductor layer, which may contain conductive particles dispersed in amatrix material, and the conductor layer is electrically connected tothe first conductive film formed on the other surface of the oppositesubstrate. If the conductor layer is held at a constant potential,therefore, the first conductive film is also held at a constantpotential via the conductor layer. Accordingly, it is possible toprevent the second substrate from being charged. Herein, the conductorlayer may be a layer containing conductive particles dispersed in amatrix material, and can be formed by the application and subsequenthardening of a conductive paste. It is therefore possible to reliablyachieve electrical connection between the first conductive film and theconductor layer, and to easily and reliably achieve, in the gap betweenthe second substrate and the frame portion or in a deep portion of thegap, electrical connection of the conductor layer to another member heldat a constant potential. Accordingly, it is possible to reliably preventthe opposite substrate from being charged.

Preferably, in the embodiment, an inner surface of the frame portion maybe formed with an indentation, and an air gap formed by the indentationmay be filled with the conductor layer. With this configuration, it ispossible to fill the gap between the frame portion of the support memberand the second substrate with a sufficient amount of the conductor layer(conductive paste). Accordingly, it is possible to reliably achieve, inthe gap between the second substrate and the frame portion or in a deepportion of the gap, electrical connection of the conductor layer toanother member held at a constant potential.

Preferably, in the embodiment, the first substrate may be attached witha conductive tape for fixing the first substrate to the support member,and the conductive tape may be in contact with the conductor layer. Onthe side of the other surface of the first substrate, a wiringsubstrate, such as a flexible substrate, is present. If the conductivetape in contact with the conductor layer is arranged on the side of theother surface of the first substrate, therefore, it is possible to holdthe conductive tape at a constant potential via the wiring substrate orthe like, and consequently to hold the front surface-side conductivefilm at a constant potential via the conductive tape.

The present application in an embodiment may adopt a configuration whichfurther includes a wiring substrate connected to the first substrate, inwhich the wiring substrate is formed with wiring held at a constantpotential, and in which the conductive tape is electrically connected tothe wiring.

The present application in an embodiment may adopt a configuration inwhich the support member further includes a metal case held at aconstant potential, and in which the first substrate is attached to themetal case via the conductive tape.

The present application in an embodiment may adopt a configuration whichfurther includes a second conductive film formed on the other surface ofthe first substrate and an insulating member arranged on the side of theother surface of the first substrate, in which a base material of thefirst substrate is an insulating substrate, and in which the conductivetape is attached to and electrically connected to the second conductivefilm on the side of the other surface of the first substrate. With thisconfiguration, it is possible to hold the second conductive film formedon the other surface of the first substrate at a constant potential byusing the conductive tape used to hold the first conductive film at aconstant potential, and to prevent the insulating member from beingcharged.

The present application in an embodiment may adopt a configuration inwhich the support member further includes a metal case held at aconstant potential, with at least a portion of the metal case exposed tothe inside in the frame portion, and in which the conductor layer iselectrically connected to the exposed portion. With this configuration,it is possible to hold the conductor layer at a constant potential viathe metal case, and to hold the first conductive film at a constantpotential via the conductor layer.

Also in this case, the present application in an embodiment maypreferably include a second conductive film formed on the other surfaceof the first substrate, an insulating member arranged on the side of theother surface of the first substrate, and a conductive tape attached toand electrically connected to the second conductive film on the side ofthe other surface of the first substrate. Further, a base material ofthe first substrate may be an insulating substrate, and the conductorlayer may be electrically connected to the conductive tape. With thisconfiguration, it is possible to hold the conductive tape at a constantpotential via the conductor layer for holding the first conductive filmat a constant potential, and to hold the second conductive film formedon the other surface of the first substrate at a constant potential.Accordingly, it is possible to prevent the insulating member from beingcharged.

The electro-optical device applied with the embodiment of the presentapplication is used in electronic equipment, such as a mobile computer,a mobile phone, a car navigation device, and a personal computer.

Additional features and advantages are described herein, and will beapparent from the following Detailed Description and the figures.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a plan view of electro-optical devices according to first andsecond embodiments and modified examples of the second embodiment;

FIG. 2 is an exploded perspective view of the electro-optical deviceaccording to the first embodiment;

FIGS. 3A and 3B are cross-sectional views schematically illustrating theelectro-optical device according to the first embodiment cut atpositions corresponding to lines IIIA-IIIA and IIIB-IIIB in FIG. 1,respectively;

FIGS. 4A and 4B are cross-sectional views schematically illustrating theelectro-optical device according to the first embodiment cut atpositions corresponding to lines IVA-IVA and IVB-IVB in FIG. 1,respectively;

FIGS. 5A and 5B are cross-sectional views schematically illustrating theelectro-optical device according to the first embodiment cut atpositions corresponding to lines VA-VA and VB-VB in FIG. 1,respectively;

FIGS. 6A and 6B are cross-sectional views schematically illustrating theelectro-optical device according to the first embodiment cut atpositions corresponding to lines VIA-VIA and VIB-VIB in FIG. 1,respectively;

FIG. 7 is an exploded perspective view of an electro-optical deviceaccording to a second embodiment;

FIGS. 8A and 8B are cross-sectional views schematically illustrating theelectro-optical device according to the second embodiment cut atpositions corresponding to lines VIIIA-VIIIA and VIIIB-VIIIB in FIG. 1,respectively;

FIG. 9 is a cross-sectional view illustrating a connection structurebetween a conductive tape and a flexible substrate in an electro-opticaldevice according to a first modified example of the second embodiment;

FIG. 10 is a cross-sectional view illustrating a connection structurebetween the conductive tape and the flexible substrate in anelectro-optical device according to a second modified example of thesecond embodiment;

FIG. 11 is a cross-sectional view illustrating a connection structurebetween the conductive tape and a metal case in an electro-opticaldevice according to a third modified example of the second embodiment;

FIG. 12 is a plan view of an electro-optical device according to a thirdembodiment;

FIG. 13 is an exploded perspective view of the electro-optical deviceaccording to the third embodiment;

FIGS. 14A and 14B are cross-sectional views schematically illustratingthe electro-optical device according to the third embodiment cut atpositions corresponding to lines XIVA-XIVA and XIVB-XIVB in FIG. 12,respectively;

FIGS. 15A and 15B are cross-sectional views schematically illustratingan electro-optical device according to a modified example of the thirdembodiment cut at positions corresponding to lines XVA-XVA and XVB-XVBin FIG. 12, respectively; and

FIGS. 16A to 16C are explanatory diagrams of electronic equipment usingan input function-equipped display device according to an embodiment.

DETAILED DESCRIPTION

With reference to the drawings, embodiments of the present applicationwill be described. In the drawings referred to in the followingdescription, different scales are used for individual layers andcomponents to illustrate the layers and components in a recognizablesize in the drawings.

First Embodiment

Overall Configuration of Electro-Optical Device: FIGS. 1 and 2 are aplan view and an exploded perspective view of an electro-optical deviceaccording to a first embodiment. FIGS. 3A and 3B are cross-sectionalviews schematically illustrating the electro-optical device according tothe first embodiment cut at positions corresponding to lines IIIA-IIIAand IIIB-IIIB in FIG. 1, respectively. FIGS. 4A and 4B arecross-sectional views schematically illustrating the electro-opticaldevice according to the first embodiment cut at positions correspondingto lines IVA-IVA and IVB-IVB in FIG. 1, respectively. In FIG. 1, an areaattached with a later-described conductive tape is illustrated as aregion indicated by a group of three backslashes.

As illustrated in FIGS. 1 and 2, an electro-optical device 100 (liquidcrystal device) of the present embodiment includes a transmissive orsemi-transmissive reflective liquid crystal panel 1 and an illuminationdevice 8 arranged on the rear side of the liquid crystal panel 1. Theillumination device 8 and the liquid crystal panel 1 are held by asupport member 9. The support member 9 is formed by a rectangularframe-like resin case 91 and a box-like metal case 92 for holding theresin case 91 from outside. In the resin case 91, one of four side plateportions 917 located on the drawing side of a flexible substrate 7 isformed with a recessed portion 914, and the inner side of the remainingthree side plate portions 917 is formed with a step portion 911 havingan upper surface for holding the liquid crystal panel 1. A portion ofthe resin case 91 near the side plate portion 917 located on the drawingside of the flexible substrate 7 forms a step portion 911-absent portion915, in which the step portion 911 is not formed. The metal case 92includes a rectangular bottom plate portion 925 and four side plateportions 927 standing upright on the outer edge of the bottom plateportion 925. One of the side plate portions 927 located on the drawingside of the flexible substrate 7 is formed with a recessed portion 924at a position overlapping with the recessed portion 914 of the resincase 91. The metal case 92 is held at the ground potential. In the thusconfigured resin case 91 and metal case 92, the side plate portions 917and 927 are superimposed upon each other to form a frame portion 93surrounding the periphery of the liquid crystal panel 1.

The liquid crystal panel 1 includes a device substrate 11 (firstsubstrate), an opposite substrate 12 (second substrate) arrangedopposite to a first surface 11 a of the device substrate 11 (one surfaceof the device substrate 11), and a rectangular frame-like sealing member13 for attaching the device substrate 11 and the opposite substrate 12together in a substrate peripheral portion. The liquid crystal panel 1holds liquid crystal 14, which is an electro-optical material held in aspace formed by the device substrate 11, the opposite substrate 12, andthe sealing member 13. Further, the device substrate 11 includes aprojecting region 118 projecting from an end portion of the oppositesubstrate 12. In the present embodiment, the respective base materialsof the device substrate 11 and the opposite substrate 12 are translucentinsulating substrates 110 and 120 made of glass or the like. The devicesubstrate 11 and the opposite substrate 12 are held by the supportmember 9 such that the opposite substrate 12 is located outside thedevice substrate 11 (on the output side of display light).

The first surface 11 a of the device substrate 11 opposite to theopposite substrate 12 is formed with insular pixel electrodes 16 formedby an ITO (Indium Tin Oxide) film or an IZO (Indium Zinc Oxide) film,pixel switching elements, signal lines (not illustrated) such asscanning lines and data lines, and so forth. Further, an oriented film(not illustrated) made of polyimide or the like is formed to cover thepixel electrodes 16.

In the present embodiment, the liquid crystal panel 1 is a liquidcrystal panel based on the IPS system or the FFS system, and drives theliquid crystal 14 by using a lateral electric field. Thus, the devicesubstrate 11 is also formed with common electrodes 17 formed by an ITOfilm or an IZO film. Therefore, a first surface 12 a of the oppositesubstrate 12 opposite to the device substrate 11 (one surface of theopposite substrate 12) is not formed with the common electrodes 17, andany other electrode or wiring is not formed on first surface 12 a. Thefirst surface 12 a of the opposite substrate 12 is formed with anoriented film (not illustrated), which is an insulating film. Further,the first surface 12 a of the opposite substrate 12 may be formed with,for example, an internal phase difference layer and a color filter layer(not illustrated), which are also insulating layers.

The IPS system adopts a configuration in which the pixel electrodes 16and the common electrodes 17 are opposite to each other in the lateraldirection. The FFS system adopts a configuration in which the pixelelectrodes 16 and the common electrodes 17 are formed in different upperand lower layers with a dielectric film interposed therebetween. Thedrawings referred to in the present embodiment, however, schematicallyillustrate the pixel electrodes 16 and the common electrodes 17 asopposite to each other in the lateral direction also in the FFS system,as well as in the IPS system.

In the liquid crystal panel 1, an upper polarizing plate 15 a isarranged in a superimposed manner on a second surface 12 b of theopposite substrate 12 on the opposite side of the first surface 12 aopposite to the device substrate 11 (the other surface of the oppositesubstrate 12). Further, a lower polarizing plate 15 b is arranged in asuperimposed manner on a second surface 11 b of the device substrate 11on the opposite side of the first surface 11 a opposite to the oppositesubstrate 12 (the other surface of the device substrate 11).

Herein, a translucent front surface-side conductive film 18 (firstconductive film) formed by an ITO film, an IZO film, or the like isprovided on the entire surface or a substantially entire surface of thesecond surface 12 b of the opposite substrate 12 in order to prevent theopposite substrate 12 from being charged. The front surface-sideconductive film 18 is held at a constant potential (ground potential inthe present embodiment) by a configuration which will be described indetail later.

In the thus configured electro-optical device 100, the light output fromthe illumination device 8 is incident on the device substrate 11, andthe incident light is optically modulated and output from the oppositesubstrate 12. Thereby, an image is displayed.

As illustrated in FIGS. 1, 2, 3A, and 3B, the projecting region 118 ofthe device substrate 11 is mounted with a drive IC (Integrated Circuit)98 by an anisotropic conductive film or the like. A terminal 190 formedin an end portion of the projecting region 118 is connected to aterminal 741 formed in a main body portion 78 of the flexible substrate7 serving as a wiring substrate. Therefore, a variety of externallysupplied signals and power can be input to the liquid crystal panel 1via the flexible substrate 7.

In the flexible substrate 7, a band-like portion 72 extends from themain body portion 78 thereof, and a leading end portion of the band-likeportion 72 is formed with a light source mounting portion 71, thelongitudinal direction of which is set to the width direction of theliquid crystal panel 1. The light source mounting portion 71 is formedwith light source mounting terminals 751, which are mounted withpoint-like light sources 3 of the illumination device 8. Therefore, thepoint-like light sources 3 are supplied with a light source drivevoltage via the flexible substrate 7. A surface of the flexiblesubstrate 7 mounted with the point-like light sources 3 is also mountedwith electronic components 35, such as a surface-mount capacitor.

The flexible substrate 7 is a multilayer substrate or a double-sidedsubstrate. When the light source mounting portion 71 is viewed from theside opposite to the side mounted with the point-like light sources 3, aregion overlapping with the light source mounting terminals 751 in aplan view is formed with a conductive pattern 742 with an insulatinglayer 70, such as a polyimide layer, interposed between the conductivepattern 742 and the light source mounting terminals 751. The conductivepattern 742 is a solid ground pattern formed all over a predeterminedarea without a gap. Therefore, the conductive pattern 742 is used forshielding light from the point-like light sources 3, for electromagneticshielding, or for heat radiation. In the flexible substrate 7, theconductive pattern 742 and the terminal 741 are formed on one surface ofthe insulating layer 70 formed by a film base material of the flexiblesubstrate 7, and the light source mounting terminals 751 are formed onthe other surface of the insulating layer 70. In the present embodiment,the plurality of point-like light sources 3 are surface-mount white LEDs(Light-Emitting Diodes) mounted at predetermined intervals with anoutput light axis L set to a direction parallel to the plane of thelight source mounting portion 71 of the flexible substrate 7.

Overall Configuration of Illumination Device 8: The illumination device8 includes a substantially rectangular light guide plate 6 which has afirst surface 6 a serving as a light-emitting surface and directedtoward the device substrate 11 of the liquid crystal panel 1, theplurality of point-like light sources 3 formed by white LEDs arrangedalong an end portion 6 e of the light guide plate 6, a reflective sheet27 arranged in a superimposed manner on a second surface 6 b of thelight guide plate 6 on the opposite side of the first surface 6 a, and aplurality of optical sheets arranged in a superimposed manner on thefirst surface 6 a of the light guide plate 6. As the plurality ofoptical sheets, a rectangular scattering plate 23, a rectangular prismsheet 24, a rectangular prism sheet 25, and a rectangular scatteringplate 26 are sequentially arranged in a superimposed manner from theside of the light guide plate 6 toward the liquid crystal panel 1 in thepresent embodiment. The light guide plate 6 is for uniformly applyingthe light output from the point-like light sources 3 within a surface ofthe liquid crystal panel 1, and is made of a translucent material, suchas an acrylic resin and polycarbonate. The scattering plates 23 and 26are for improving the equalization of brightness of the light within adisplay screen. The prism sheets 24 and 25 are for adjusting theorientation angle of the output light and improving the brightness inthe frontal direction.

The end portion 6 e of the light guide plate 6 includes indentation-likelight source placement openings 61 formed at predetermined intervalsalong a side of the end portion 6 e. One of the inner walls of each ofthe light source placement openings 61 forms a light incident portion 61a, on which the light output from the corresponding point-like lightsource 3 is incident. In the flexible substrate 7, therefore, if theband-like portion 72 is bent such that the surface of the light sourcemounting portion 71 mounted with the point-like light sources 3 facesdownward, and if the light source mounting portion 71 is superimposed onthe first surface 6 a in the end portion 6 e of the light guide plate 6,the plurality of point-like light sources 3 are placed in the respectivelight source placement openings 61, with respective light outputsurfaces 3 a facing the light incident portions 61 a. In this process, alight-shielding sheet 29 having a lower surface formed with an adhesivelayer is attached along the end portion 6 e of the light guide plate 6,and a double-sided tape 21 is placed on the upper surface of thelight-shielding sheet 29. Therefore, the light source mounting portion71 of the flexible substrate 7 is fixed to the end portion 6 e of thelight guide plate 6 via the double-sided tape 21 and the light-shieldingsheet 29. The light-shielding sheet 29 includes rectangular openingportions 291 formed at respective positions overlapping with the lightsource placement openings 61 of the light guide plate 6 in a plan view.When the light source mounting portion 71 of the flexible substrate 7 issuperimposed on the light-shielding sheet 29, therefore, the pluralityof point-like light sources 3 are placed in the respective light sourceplacement openings 61 through the opening portions 291.

Measures against Charging of Opposite Substrate 12: FIGS. 5A and 5B arecross-sectional views schematically illustrating the electro-opticaldevice according to the first embodiment cut at positions correspondingto lines VA-VA and VB-VB in FIG. 1, respectively. FIGS. 6A and 6B arecross-sectional views schematically illustrating the electro-opticaldevice according to the first embodiment cut at positions correspondingto lines VIA-VIA and VIB-VIB in FIG. 1, respectively.

In the electro-optical device 100 of the present embodiment, the basematerial of the opposite substrate 12 is formed by the translucentinsulating substrate 120, and the first surface 12 a of the oppositesubstrate 12 is not formed with an electrode or the like. Further, theopposite substrate 12 is arranged on the outer side. If a charged fingerapproaches the opposite substrate 12, therefore, the opposite substrate12 is charged. The charging disturbs the orientation of the liquidcrystal 14, and degrades the image quality.

Therefore, the translucent front surface-side conductive film 18 formedby an ITO film, an IZO film, or the like is provided on the entiresurface or a substantially entire surface of the second surface 12 b ofthe opposite substrate 12. The front surface-side conductive film 18 isheld at a constant potential (ground potential in the presentembodiment) by the configuration described below.

First, in the present embodiment, a conductive tape 28 is attached tothe second surface 11 b of the device substrate 11 along three sides ofthe device substrate 11, as illustrated in FIGS. 1, 2, 3A, 3B, 4B, 5A,5B, 6A, and 6B. The conductive tape 28 is a double-sided tape having aconductive adhesive layer formed on each of both surfaces of a metalfilm. One surface of the conductive tape 28 is bonded to the secondsurface 11 b of the device substrate 11. Further, on the rear surfaceside of the projecting region 118 of the device substrate 11, theconductive tape 28 is bonded to the conductive pattern 742 (groundpattern) formed on the light source mounting portion 71 of the flexiblesubstrate 7. Therefore, the conductive tape 28 is constantly held at theground potential (constant potential). For example, in the conductivetape 28, a layer containing conductive powder of copper, nickel, analloy thereof, carbon, or the like dispersed in an adhesive is used asthe conductive adhesive layer. Further, a film made of a metal, such ascopper, nickel, stainless steel, aluminum, an alloy thereof, or the likeis used as the metal film.

Further, the conductive tape 28 has a function of fixing the devicesubstrate 11 to the resin case 91, as illustrated in FIGS. 4B, 5A, 5B,6A, and 6B. That is, one surface of the conductive tape 28 is bonded tothe second surface 11 b of the device substrate 11, and the othersurface of the conductive tape 28 is bonded to the upper surface of thestep portion 911 formed on the inner side of the resin case 91.

In the present embodiment, as illustrated in FIGS. 1 and 2, theconductive tape 28 is formed by three band-like portions 28 a, 28 b, and28 c extending along three sides of the second surface 11 b of thedevice substrate 11 excluding one end portion corresponding to theposition of the projecting region 118. The mutually adjacent band-likeportions 28 a and 28 c are connected, and the mutually adjacentband-like portions 28 b and 28 c are connected. Thus, the conductivetape 28 is formed by a single tape integrally connecting the band-likeportions 28 a, 28 b, and 28 c. Herein, the lower polarizing plate 15 bis bonded to the second surface 11 b of the device substrate 11. Thus,the lower polarizing plate 15 b is set to a size allowing the placementthereof in the area surrounded by the conductive tape 28. In the secondsurface 11 b of the device substrate 11, the conductive tape 28 isarranged to surround the periphery of the lower polarizing plate 15 b.Even if the conductive tape 28 is attached to the second surface 11 b ofthe device substrate 11, therefore, an unnecessary gap is not formedbetween the second surface 11 b of the device substrate 11 and the lowerpolarizing plate 15 b. The conductive tape 28 may be configured suchthat the three band-like portions 28 a, 28 b, and 28 c are divided.Preferably, each of the band-like portions 28 a, 28 b, and 28 c may bearranged to extend along at least one side of the device substrate 11.

Further, in the present embodiment, as illustrated in FIGS. 1 and 2,inner surfaces of the side plate portions 917 of the resin case 91,which form inner surfaces of the frame portion 93 in the support member9, are formed with a plurality of groove-like indentations 917 a whichextend from the upper surface of the side plate portions 917 to aposition reaching the upper surface of the step portion 911. Theinterior of each of the plurality of indentations 917 a (a gap betweenthe frame portion 93 and the combination of the device substrate 11 andthe opposite substrate 12) is filled with a conductor layer 40. Theconductor layer 40 is formed by the application and subsequent hardeningof a conductive paste containing conductive particles, such as carbonparticles, and a matrix material, such as resin and rubber, dispersed ina solvent. The conductive particles, such as carbon particles, aredispersed in the matrix material, such as resin and rubber.

In the present embodiment, the indentations 917 a are formed atsubstantially equal intervals in each of two of the four side plateportions 917 of the resin case 91 corresponding to the longer sides ofthe resin case 91. In a portion not formed with the indentations 917 a,a gap between the frame portion 93 and the combination of the devicesubstrate 11 and the opposite substrate 12 is not filled with theconductor layer 40. In the present embodiment, each of the indentations917 a is formed into a circular arc shape in a plan view. The side plateportions 917 may be formed with at least one of the indentations 917 afilled with the conductor layer 40, and the indentation 917 a may beformed in a side plate portion 917 corresponding to a shorter side ofthe resin case 91. If there is a sufficient gap between the frameportion 93 and the combination of the device substrate 11 and theopposite substrate 12, the formation of the indentations 917 a may beomitted.

Herein, the conductor layer 40 is formed to cover end portions of thesecond surface 12 b of the opposite substrate 12. On the second surface12 b of the opposite substrate 12, the front surface-side conductivefilm 18 is formed to extend to the edges of the second surface 12 b.Meanwhile, the upper polarizing plate 15 a has a size smaller than thearea formed with the front surface-side conductive film 18, and thefront surface-side conductive film 18 is exposed from edge portions ofthe upper polarizing plate 15 a. Therefore, the conductor layer 40 is incontact with the front surface and the side end surfaces of the frontsurface-side conductive film 18, and is electrically connected to thefront surface-side conductive film 18.

Further, a gap between the device substrate 11 and the frame portion 93is also filled with the conductor layer 40. In respective bottomportions of the indentations 917 a, the conductor layer 40 is in contactwith the upper surface and the side end surfaces of the conductive tape28, and is electrically connected to the conductive tape 28. Therefore,the conductor layer 40 is held at the ground potential (constantpotential) via the conductive tape 28, and the front surface-sideconductive film 18 is held at the ground potential (constant potential)via the conductor layer 40.

In the present embodiment, the uppermost position of the frame portion93 is higher than the liquid crystal panel 1. In the application of theconductive paste, therefore, the conductive paste is prevented fromoverflowing outside the frame portion 93. Further, the upper surface ofthe conductor layer 40 is located at an intermediate position in thethickness direction of the upper polarizing plate 15 a, and does notsubstantially cover the upper polarizing plate 15 a.

Method of Assembling Electro-Optical Device 100: To assemble theelectro-optical device 100 of the present embodiment, the frontsurface-side conductive film 18 is first formed on the second surface 12b of the opposite substrate 12 before or after the opposite substrate 12is assembled into the liquid crystal panel 1. In this case, from theviewpoint of avoiding the influence of the temperature and plasma in theformation of the front surface-side conductive film 18, it is preferredto form the front surface-side conductive film 18 on the second surface12 b of the opposite substrate 12 before the opposite substrate 12 isassembled into the liquid crystal panel 1. Then, the upper polarizingplate 15 a and the lower polarizing plate 15 b are respectively bondedto the two surfaces of the liquid crystal panel 1.

Further, the light guide plate 6 and the optical sheets (the scatteringplates 23 and 26 and the prism sheets 24 and 25) are laminated insidethe resin case 91. Thereafter, the light-shielding sheet 29 issuperimposed to cover the end portion 6 e of the light guide plate 6.Then, the double-sided tape 21 is attached onto the light-shieldingsheet 29. Subsequently, the band-like portion 72 of the flexiblesubstrate 7 is bent such that the surface of the light source mountingportion 71 mounted with the point-like light sources 3 faces downward,and the light source mounting portion 71 is superimposed on the firstsurface 6 a in the end portion 6 e of the light guide plate 6. Then, thelight source mounting portion 71 is pressed against the double-sidedtape 21, and is fixed to the end portion 6 e of the light guide plate 6via the double-sided tape 21 and the light-shielding sheet 29.

As a result, the illumination device 8 is completed. Then, the liquidcrystal panel 1 having the upper polarizing plate 15 a and the lowerpolarizing plate 15 b attached to the two surfaces thereof issuperimposed on the illumination device 8. Thereby, the illuminationdevice 8 and the liquid crystal panel 1 are supported by the resin case91. If the resin case 91 is stored in the metal case 92, therefore, theassembling of the electro-optical device 100 is completed. In thisprocess, the conductive tape 28 is bonded to the upper surface of thestep portion 911 of the resin case 91, and end portions of theconductive tape 28 are bonded to the conductive pattern 742 of theflexible substrate 7. Then, the liquid crystal panel 1 is placed on theupper surface of the step portion 911 of the resin case 91. Thereby, theconductive tape 28 is bonded to the second surface 11 b of the devicesubstrate 11 in the liquid crystal panel 1.

Thereafter, the indentations 917 a formed in the side plate portions 917of the resin case 91 are applied and filled with a conductive paste.Then, the conductive paste is hardened to form the conductor layer 40.As a result, the electro-optical device 100 is completed.

Major Effects of Present Embodiment: As described above, in the presentembodiment, the gap between the opposite substrate 12 and the frameportion 93 surrounding the respective peripheries of the devicesubstrate 11 and the opposite substrate 12 in the support member 9 isfilled with the conductor layer 40 containing conductive particlesdispersed in a matrix. The conductor layer 40 covers the frontsurface-side conductive film 18 formed on the second surface 12 b of theopposite substrate 12, and is electrically connected to the frontsurface-side conductive film 18. If the conductor layer 40 is held at aconstant potential, therefore, the front surface-side conductive film 18is also held at a constant potential via the conductor layer 40.Accordingly, it is possible to prevent the opposite substrate 12 frombeing charged. Herein, the conductor layer 40 is a layer containingconductive particles dispersed in a matrix, and can be formed by theapplication and subsequent hardening of a conductive paste. It istherefore possible to reliably achieve electrical connection between thefront surface-side conductive film 18 and the conductor layer 40. It isalso possible to easily and reliably achieve, in a deep portion of a gapbetween the opposite substrate 12 and the frame portion 93, electricalconnection of the conductor layer 40, which has been formed by theapplication and subsequent hardening of a conductive paste, to theconductive tape 28 held at a constant potential.

Further, in the present embodiment, inner surfaces of the frame portion93 are formed with the indentations 917 a which locally increase thewidth of the gap between the frame portion 93 and the opposite substrate12, and the interior of each of the indentations 917 a is filled withthe conductor layer 40. It is therefore possible to fill the gap betweenthe frame portion 93 of the support member 9 and the opposite substrate12 with a sufficient amount of the conductor layer 40 (conductivepaste). Accordingly, it is possible to reliably achieve, in a deepportion of the gap between the opposite substrate 12 and the frameportion 93, electrical connection of the conductor layer 40 to theconductive tape 28 held at a constant potential.

Further, in the present embodiment, the conductive tape 28 is directlybonded to the conductive pattern 742 of the flexible substrate 7. It istherefore possible to hold the front surface-side conductive film 18 atthe ground potential in a small space. Further, it is unnecessary to usea special conductive cable.

Further, the conductive tape 28 is a double-sided tape having aconductive adhesive layer formed on each of both surfaces thereof. Theconductive tape 28 is also used to fix the device substrate 11(insulating substrate 110) and the support member 9 (resin case 91) toeach other, and thus provides an advantage of not using a separatedouble-sided tape for fixing the device substrate 11 (insulatingsubstrate 110) and the support member 9 (resin case 91) to each other.

Second Embodiment

FIG. 7 is an exploded perspective view of an electro-optical deviceaccording to a second embodiment. FIGS. 8A and 8B are cross-sectionalviews schematically illustrating the electro-optical device according tothe second embodiment cut at positions corresponding to linesVIIIA-VIIIA and VIIIB-VIIIB in FIG. 1, respectively. A basicconfiguration of the present embodiment is similar to the configurationof the first embodiment. Thus, the common components will be illustratedwith the same reference numerals, and description thereof will beomitted.

Also in the electro-optical device 100 illustrated in FIGS. 7, 8A, and8B, the gap between the opposite substrate 12 and the frame portion 93surrounding the respective peripheries of the device substrate 11 andthe opposite substrate 12 in the support member 9 is filled with theconductor layer 40 containing conductive particles dispersed in amatrix, as described in the first embodiment with reference to, forexample, FIGS. 1, 6A, and 6B. The conductor layer 40 is electricallyconnected to the front surface-side conductive film 18 formed on thesecond surface 12 b of the opposite substrate 12, and is alsoelectrically connected to the conductive tape 28 attached to the secondsurface 11 b of the device substrate 11. Further, the conductive tape 28is also bonded to the conductive pattern 742 (ground pattern) formed onthe flexible substrate 7. Therefore, it is possible to hold the frontsurface-side conductive film 18 at the ground potential, and thus toprevent the opposite substrate 12 from being charged.

Further, with the use of the conductive tape 28, the present embodimentprevents the generation of high-frequency noise sound attributed to thecharging of the scattering plate 26, the prism sheet 25, the prism sheet24, the scattering plate 23, or the light guide plate 6, as describedbelow.

First, in the present embodiment, the entire surface or a substantiallyentire surface of the second surface 11 b of the device substrate 11 isprovided with a rear surface-side conductive film 19 (second conductivefilm) formed by a translucent conductive film, such as an ITO film, andserving as a charging preventing conductive film. Further, on the sideof the second surface 11 b of the device substrate 11, the conductivetape 28 is attached to the rear surface-side conductive film 19 alongthree sides of the device substrate 11. Also in the present embodiment,the conductive tape 28 is a double-sided tape having a conductiveadhesive layer formed on each of both surfaces of a metal film.Therefore, the rear surface-side conductive film 19 is held at theground potential (constant potential) via the conductive tape 28.Accordingly, it is possible to prevent the insulating substrate 110 andinsulating members (the lower polarizing plate 15 b, the scatteringplate 26, the prism sheet 25, the prism sheet 24, the scattering plate23, and the light guide plate 6) from being charged.

Further, the conductive tape 28 is attached to a wide area of the rearsurface-side conductive film 19. Even if the rear surface-sideconductive film 19 has a high sheet resistance, therefore, it ispossible to reliably hold the entirety of the rear surface-sideconductive film 19 at a constant potential. Accordingly, it is possibleto reliably prevent the insulating substrate 110 and the insulatingmembers (the lower polarizing plate 15 b, the scattering plate 26, theprism sheet 25, the prism sheet 24, the scattering plate 23, and thelight guide plate 6) from being charged. Even if the common electrodes17 are applied with a common potential of a predetermined frequency,therefore, charging and vibration of the insulating members (the lowerpolarizing plate 15 b, the scattering plate 26, the prism sheet 25, theprism sheet 24, the scattering plate 23, and the light guide plate 6) donot occur. Accordingly, it is possible to reliably prevent thegeneration of high-frequency noise.

Modified Examples of First and Second Embodiments

FIGS. 9, 10, and 11 are cross-sectional views illustrating connectionstructures between the conductive tape 28 and the flexible substrate 7in electro-optical devices according to first, second, and thirdmodified examples of the second embodiment, respectively. The drawingscorrespond to cross-sectional views of the electro-optical devices cutat positions corresponding to lines IX-IX, X-X, and XI-XI in FIG. 1,respectively. A basic configuration of the present examples is similarto the configuration of the first embodiment. Thus, the commoncomponents will be illustrated with the same reference numerals, anddescription thereof will be omitted.

Also in the electro-optical device 100 illustrated in FIG. 9, theconductive tape 28 is attached to the rear surface-side conductive film19 on the second surface 11 b of the device substrate 11 such that theconductive tape 28 extends along three sides of the device substrate 11,similarly as in the second embodiment. Herein, a surface of the lightsource mounting portion 71 of the flexible substrate 7 mounted with thepoint-like light sources 3 described with reference to FIGS. 3A and 4Ais formed with a conductive pattern 752 (ground pattern), and theconductive pattern 752 is bonded to one surface of the conductive tape28. The other configurations are similar to the correspondingconfigurations of the first and second embodiments, and thus descriptionthereof will be omitted.

Also in the electro-optical device 100 illustrated in FIG. 10, theconductive tape 28 is attached to the rear surface-side conductive film19 on the second surface 11 b of the device substrate 11 such that theconductive tape 28 extends along three sides of the device substrate 11,similarly as in the second embodiment. Herein, a surface of the mainbody portion 78 of the flexible substrate 7 provided with the terminal741 is formed with a conductive pattern 782 (ground pattern), and theconductive pattern 782 is bonded to one surface of the conductive tape28. The other configurations are similar to the correspondingconfigurations of the first and second embodiments, and thus descriptionthereof will be omitted.

Also in the electro-optical device 100 illustrated in FIG. 11, theconductive tape 28 is attached to the rear surface-side conductive film19 on the second surface 11 b of the device substrate 11 such that theconductive tape 28 extends along three sides of the device substrate 11,similarly as in the second embodiment. Herein, the metal case 92 is heldat the ground potential, and is configured such that a portion of a sideplate portion 927 of the metal case 92 is directly exposed to the insidefrom the recessed portion 914 of the resin case 91. In the presentexample, therefore, one surface of the conductive tape 28 is bonded tothe inner surface of the side plate portion 927 of the metal case 92.The other configurations are similar to the corresponding configurationsof the first and second embodiments, and thus description thereof willbe omitted.

The above-described modified examples are application examples of theconfigurations illustrated in FIGS. 9 to 11, as based on the secondembodiment. The configurations illustrated in FIGS. 9 to 11 may also beapplied on the basis of the first embodiment.

Third Embodiment

FIGS. 12 and 13 are a plan view and an exploded perspective view of anelectro-optical device according to a third embodiment, respectively.FIGS. 14A and 14B are cross-sectional views schematically illustratingthe electro-optical device according to the third embodiment cut atpositions corresponding to lines XIVA-XIVA and XIVB-XIVB in FIG. 12,respectively. A basic configuration of the present embodiment is similarto the configuration of the first embodiment. Thus, the commoncomponents will be illustrated with the same reference numerals, anddescription thereof will be omitted.

As described with reference to FIGS. 1 to 4B, in the electro-opticaldevice 100 of the present embodiment, the base material of the oppositesubstrate 12 is formed by the translucent insulating substrate 120, andthe first surface 12 a of the opposite substrate 12 is not formed withan electrode or the like. Further, the opposite substrate 12 is arrangedon the outer side. If a charged finger approaches the opposite substrate12, therefore, the opposite substrate 12 is charged. The chargingdisturbs the orientation of the liquid crystal 14, and degrades theimage quality. Therefore, the translucent front surface-side conductivefilm 18 formed by an ITO film, an IZO film, or the like is provided onthe entire surface or a substantially entire surface of the secondsurface 12 b of the opposite substrate 12. The front surface-sideconductive film 18 is held at a constant potential (ground potential inthe present embodiment) by the configuration described below.

First, in the present embodiment, a double-sided tape 22 is attached tothe second surface 11 b of the device substrate 11 along three sides ofthe device substrate 11, as illustrated in FIGS. 12, 13, 14A, and 14B.The double-sided tape 22 is not a conductive tape, but is alight-shielding insulating tape. The double-sided tape 22 has a functionof fixing the device substrate 11 to the resin case 91.

Further, in the support member 9, side plate portions 917 of the resincase 91 forming inner surfaces of the frame portion 93 are formed with aplurality of indentations 917 c which extend from the upper surface ofthe side plate portions 917 to a position reaching the upper surface ofthe step portion 911, similarly as in the first embodiment. Herein, theindentations 917 c pierce through the side plate portions 917 in thethickness direction (inside-outside direction), and the side plateportions 927 of the metal case 92 are exposed in the indentations 917 c.

The interior of each of the plurality of indentations 917 c (the gapbetween the frame 93 and the combination of the device substrate 11 andthe opposite substrate 12) is filled with the conductor layer 40. Theconductor layer 40 is formed by the application and subsequent hardeningof a conductive paste, and contains conductive particles, such as carbonparticles, dispersed in a matrix, such as resin or rubber, similarly asin the first embodiment. In the present embodiment, the indentations 917c are formed at respective positions separate from one another atsubstantially equal intervals in each of two of the four side plateportions 917 of the resin case 91 located in the direction of the longersides of the resin case 91. In a portion not formed with theindentations 917 c, a gap between the frame portion 93 and thecombination of the device substrate 11 and the opposite substrate 12 isnot filled with the conductor layer 40. Each of the indentations 917 cis formed into a circular arc shape in a plan view.

Further, the conductor layer 40 is formed to cover end portions of thesecond surface 12 b of the opposite substrate 12. On the side of thesecond surface 12 b of the opposite substrate 12, the conductor layer 40is in contact with the front surface and the side end surfaces of thefront surface-side conductive film 18, and is electrically connected tothe front surface-side conductive film 18.

In the thus configured electro-optical device 100, the metal case 92 isheld at the ground potential (constant potential). Therefore, theconductor layer 40 is held at the ground potential (constant potential)via the metal case 92, and the front surface-side conductive film 18 isheld at the ground potential (constant potential) via the conductorlayer 40. It is therefore possible to prevent the opposite substrate 12from being charged.

Further, the frame portion 93 is formed with the indentations 917 cwhich locally increase the width of the gap between the frame portion 93and the opposite substrate 12. In the indentations 917 c, the side plateportions 927 of the metal case 92 are exposed. Further, the interior ofeach of the indentations 917 c is filled with the conductor layer 40. Itis therefore possible to fill the gap between the frame portion 93 ofthe support member 9 and the opposite substrate 12 with a sufficientamount of the conductor layer 40 (conductive paste), and to electricallyconnect the front surface-side conductive film 18 to the metal case 92in a short path. Accordingly, it is possible to reliably prevent theopposite substrate 12 from being charged.

Modified Example of Third Embodiment

FIGS. 15A and 15B are cross-sectional views schematically illustratingan electro-optical device according to a modified example of the thirdembodiment cut at positions corresponding to lines XVA-XVA and XVB-XVBin FIG. 12, respectively. A basic configuration of the present examplecorresponds to a structure of the third embodiment, in which thedouble-sided tape 22 is replaced with the conductive tape 28 and thesecond surface 11 b of the device substrate 11 is formed with the rearsurface-side conductive film 19 for preventing charging. The otherconfigurations are similar to the corresponding configurations of thefirst to third embodiments. Thus, the common components will beillustrated with the same reference numerals, and description thereofwill be omitted.

Also in the electro-optical device 100 of the present example, the basematerial of the opposite substrate 12 is formed by the translucentinsulating substrate 120, and the entire surface or a substantiallyentire surface of the second surface 12 b is provided with thetranslucent front surface-side conductive film 18 formed by an ITO film,an IZO film, or the like, similarly as in the first, second, and thirdembodiments. Further, as illustrated in FIGS. 15A and 15B, the entiresurface or a substantially entire surface of the second surface 11 b ofthe device substrate 11 (the rear surface of the insulating substrate110) is provided with the rear surface-side conductive film 19, and theconductive tape 28 is attached to the rear surface-side conductive film19 along three sides of the insulating substrate 110, similarly as inthe second embodiment.

In the present example, side plate portions 917 of the resin case 91forming inner surfaces of the frame portion 93 in the support member 9are formed with the indentations 917 c piercing through the side plateportions 917 in the thickness direction (inside-outside direction), andthe side plate portions 927 of the metal case 92 are exposed in theindentations 917 c, similarly as in the third embodiment. Further, theinterior of each of the plurality of indentations 917 c (the gap betweenthe frame portion 93 and the combination of the device substrate 11 andthe opposite substrate 12) is filled with the conductor layer 40.

The conductor layer 40 is formed to cover end portions of the secondsurface 12 b of the opposite substrate 12, and is electrically connectedto the front surface-side conductive film 18. It is therefore possibleto hold the front surface-side conductive film 18 at a constantpotential (ground potential), and thus to prevent the opposite substrate12 from being charged.

Further, the conductor layer 40 is electrically connected to theconductive tape 28 in respective bottom portions of the indentations 917c. It is therefore possible to hold the rear surface-side conductivefilm 19 at a constant potential (ground potential). Accordingly, it ispossible to prevent the insulating members (the lower polarizing plate15 b, the scattering plate 26, the prism sheet 25, the prism sheet 24,the scattering plate 23, and the light guide plate 6) from beingcharged.

Other Embodiments

In the above-described embodiments, the front surface-side conductivefilm 18 and the rear surface-side conductive film 19 are held at theground potential via the conductor layer 40. The front surface-sideconductive film 18 and the rear surface-side conductive film 19 may alsobe held at a constant potential other than the ground potential. In thiscase, the use of the constant potential used in the electro-opticaldevice 100 provides an advantage of not using a separate power supplycircuit.

The above-described embodiments use a double-sided tape having aconductive adhesive layer formed on each of both surfaces thereof. Inthe configuration illustrated in FIG. 9 or 11, however, the conductivityof only one surface of the conductive tape 28 is used. In such a case, adouble-sided tape may be used which has a conductive adhesive layerformed only on one surface thereof and has an insulating adhesive layerformed on the other surface thereof. Further, in the configurationillustrated in FIG. 9 or 11, the conductivity of only one surface of theconductive tape 28 is used. Therefore, a single-sided tape may be usedwhich has a conductive adhesive layer formed only on one surface thereofand has no adhesive layer formed on the other surface thereof. Further,to bond the device substrate 11 and the resin case 91 together, adouble-sided tape not including a conductive adhesive layer may beinserted between the conductive tape 28 and the resin case 91.

In the above-described embodiments, the conductive tape 28 or thedouble-sided tape 22 has the function of bonding the device substrate 11and the resin case 91 together. The conductive tape 28 or thedouble-sided tape 22 may also be used to bond the device substrate 11and an optical sheet together.

In the above-described embodiments, the description has been made of theexample in which the present application is applied to theelectro-optical device 100 using the liquid crystal panel 1. The presentapplication may also be applied to an electro-optical device, such as anorganic electroluminescence device and an image sensor, in which theopposite substrate is placed as a sealing substrate or a cover for thedevice substrate, in order to prevent the opposite substrate from beingcharged.

Examples of Mounting on Electronic Equipment

Subsequently, description will be made of electronic equipment appliedwith the electro-optical device 100 according to the above-describedembodiments. FIG. 16A illustrates a configuration of a mobile personalcomputer including the electro-optical device 100. A personal computer2000 includes the electro-optical device 100 serving as a display unitand a main body portion 2010. The main body portion 2010 is providedwith a power switch 2001 and a keyboard 2002. FIG. 16B illustrates aconfiguration of a mobile phone including the electro-optical device100. A mobile phone 3000 includes a plurality of operation buttons 3001and scroll buttons 3002 and the electro-optical device 100 serving as adisplay unit. In accordance with the operation of the scroll buttons3002, the screen displayed on the electro-optical device 100 isscrolled. FIG. 16C illustrates a configuration of a mobile informationterminal (PDA: Personal Digital Assistant) applied with theelectro-optical device 100. A mobile information terminal 4000 includesa plurality of operation buttons 4001, a power switch 4002, and theelectro-optical device 100 serving as a display unit. In accordance withthe operation of the power switch 4002, a variety of information, suchas an address book and a schedule book, is displayed on theelectro-optical device 100.

The electronic equipment applied with the electro-optical device 100includes, as well as the examples illustrated in FIGS. 16A to 16C,electronic equipment such as a digital still camera, a liquid crystaltelevision, a viewfinder or direct monitor viewing video tape recorder,a car navigation device, a pager, an electronic notebook, a calculator,a word processor, a workstation, a videophone, a POS (Point-Of-Sale)terminal, and a banking terminal. Further, it is possible to apply theforegoing electro-optical device 100 as a display unit of these varioustypes of electronic equipment.

It should be understood that various changes and modifications to thepresently preferred embodiments described herein will be apparent tothose skilled in the art. Such changes and modifications can be madewithout departing from the spirit and scope and without diminishing itsintended advantages. It is therefore intended that such changes andmodifications be covered by the appended claims.

The invention is claimed as follows:
 1. An electro-optical devicecomprising: a first substrate; a second substrate having a first surfaceopposite to the first substrate; a metal case having an inner sideincluding a bottom portion and a frame portion rising continuously fromthe bottom portion, and configured to hold the first and secondsubstrates so that the first substrate is located between the secondsubstrate and the bottom portion and so that the first substrate and thesecond substrate are surrounded by the frame portion; a first conductivefilm formed on a second surface of the second substrate; a conductormember placed between the frame portion and the first and secondsubstrates, and electrically connected to the first conductive film; anda polarizing plate formed on the first conductive film, wherein thefirst conductive film is held at a constant potential via the conductormember, and wherein the conductor member is in contact with the innerside of the metal case.
 2. The electro-optical device according to claim1, wherein the conductive member includes a first conductive portionplaced between the frame portion and the first and second substrates,and a second conductive portion placed between the first substrate andthe bottom portion.
 3. The electro-optical device according to claim 2,wherein the first conductive portion is formed of a conductive pasteincluding a matrix material and a plurality of conductive particlescontained in the matrix material.
 4. The electro-optical deviceaccording to claim 2, further comprising: a second conductive filmformed on a second surface of the first substrate; and an insulatingmember arranged on the side of the second surface of the firstsubstrate, wherein a base material of the first substrate is aninsulating substrate, and wherein the second conductive portion iselectrically connected to the second conductive film on the side of thesecond surface of the first substrate.
 5. The electro-optical deviceaccording to claim 2, wherein the inner side of the metal case includesan exposed portion, and the second conductive portion of the conductivemember is in contact with the exposed portion of the metal case.
 6. Theelectro-optical device according to claim 2, wherein an uppermostposition of the metal case is positioned above an upper surface of thesecond substrate that is stacked on the first substrate.
 7. Electronicequipment comprising the electro-optical device according to claim
 2. 8.The electro-optical device according to claim 1, wherein the firstsubstrate is attached with a tape for fixing the first substrate to asupport member located between the first substrate and the bottomportion.
 9. The electro-optical device according to claim 1, wherein anuppermost position of the metal case is positioned above an uppersurface of the second substrate that is stacked on the first substrate.10. Electronic equipment comprising the electro-optical device accordingto claim 1.